Difference between revisions of "Tiny Assembly"

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[[image:Solderpaste_resulttoomuch.jpg]]
[[image:Solderpaste_resulttoomuch.jpg]]
[[image:Solderpaste_enough.jpg]]
[[image:Solderpaste_enough-results.jpg]]

Revision as of 19:24, 29 January 2007

Solder Paste Usage

Solder paste can easily become your secret weapon against the difficult placing of the fine-pitch components in use in this project. The most crucial parameter you can control is how much solder paste is used. If too much is used (even 1/10 of a gram too much), you will be left removing many solder bridges between pins and pads manually. Alternatively if too little is used you will be left individually soldering pins.

Below is an example of too much

SOLDERPASTE TOOMUCH.jpg

this is the result after reflowing: 5 different solder bridges that must be removed. Sometimes it is as easy as applying a small amount of liquid flux to the area then dragging a hot micro tipped iron between the two pins, drawing the bridge towards the pad. You may also want to try copper braid for wicking the excess solder away. I often find this removes too much solder.

Solderpaste resulttoomuch.jpg


Solderpaste enough.jpg


Solderpaste enough-results.jpg