Difference between revisions of "Tiny Assembly"
| Line 11: | Line 11: | ||
[[image:Solderpaste_resulttoomuch.jpg]] | [[image:Solderpaste_resulttoomuch.jpg]] | ||
Below is an image where an adequate amount of solder paste was applied. | |||
[[image:Solderpaste_enough.jpg]] | [[image:Solderpaste_enough.jpg]] | ||
The results of the above solder paste. | |||
[[image:Solderpaste_enough-results.jpg]] | [[image:Solderpaste_enough-results.jpg]] | ||
Revision as of 20:26, 29 January 2007
Solder Paste Usage
Solder paste can easily become your secret weapon against the difficult placing of the fine-pitch components in use in this project. The most crucial parameter you can control is how much solder paste is used. If too much is used (even 1/10 of a gram too much), you will be left removing many solder bridges between pins and pads manually. Alternatively if too little is used you will be left individually soldering pins.
Below is an example of too much
this is the result after reflowing: 5 different solder bridges that must be removed. Sometimes it is as easy as applying a small amount of liquid flux to the area then dragging a hot micro tipped iron between the two pins, drawing the bridge towards the pad. You may also want to try copper braid for wicking the excess solder away. I often find this removes too much solder.
Below is an image where an adequate amount of solder paste was applied.
The results of the above solder paste.
